3-D Integration and Security

We are exploring a novel approach to trustworthy system development based on 3-D integration, an emerging chip fabrication technique in which two or more integrated circuit dies are combined into a single stack using vertical conductive posts. Since the dies may be manufactured separately, 3-D circuit integration offers the option of enhancing a commodity processor with a variety of custom security functions, which are manufacturing options applicable only to those systems that require them. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems. The following is a list of our deliverables:

Journal Articles and Book Chapters

Conference Papers

Technical Reports

Seminars, Panels, and Invited Talks

PhD Dissertations

M.S. Theses

PI Meetings, Project Workshops, and Proposals